About this event
Global Semiconductor and Electronics Forum (GSEF) brings together the end to end value chain in semiconductors and consumer electronics. As one of the industry’s most important gatherings, the Forum explores current and future trends and finds solutions to business-hindering challenges.
In light of the recent global developments around the COVID-19 virus, we have made the decision to bring the Global Semiconductor and Electronics Forum to you as a virtual event this year. GSEF 2020 will offer a unique customised, networking platform, designed specifically to facilitate business development opportunities, in addition to private meeting introductions and a packed conference agenda.
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Topics covered at GSEF 2020
This year’s agenda will reflect key concerns and opportunities within the market with special attention on two leading industries: consumer electronics and the automotive industry.
Key topics will include 5G, AI, Advanced Manufacturing Processes (5nm), IoT, Connected Cars, Autonomous Driving, MEMS, Industry 4.0, Test Solutions, Silicon Design, Verification & IP, Electronics Supply Chain, Advanced Packaging Technologies, AR/VR, Big Data & Robotics.
Join our virtual forum to discuss and collaborate on key concerns, ideas and trends within the current market, create new business partnerships and meet with key decision makers within the semiconductor and electronics manufacturing industry.
Why Attend?
NETWORK
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This is an exceptional networking opportunity for industry accelerators. Meet industry C-Suite and Director level executives to make valuable connection at this annual thought leadership platform.
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Job Titles:
Chief Technology Officer
Executive/Senior Vice President of Technology
Executive/Senior Vice President
Research & Development
Executive/Senior Vice President of Engineering
Executive/Senior Vice President of Manufacturing
Executive/Senior Vice President Product Line/Function
Executive/Senior Vice President of Design
Chief Innovation OfficerFrom Europe, North America and Asia
LEARN
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Join like-minded peers to learn new perspectives and case studies through presentation, panel discussions, interactive round tables and workshops.
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GSEF is made up of:
The Global Semiconductor Forum (GSF)GSF in its own right has been running for over a decade, hosting well-respected and high-ranking semiconductor developers to present, discuss and collaborate on key concerns, ideas, and trends within the current market.
The Global Electronics Forum (GEF)
GEF has provided opportunities for delegates to develop lasting relationships, create new business partnerships and meet with key decision-makers within the electronics manufacturing industry.
Your booth just the way you want it and more. Take a quick look at all the new functions your Virtual Booth is capable of.
Experience
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Simply register, login on the day and get ready to connect and learn. With the right network at your fingertips, learning and connecting have never been so easy.
- No Travelling – reduce your carbon footprint
- No Expenses – save on accommodation
- Save time – tailor your schedule around your business needs
- Borderless – be a part of a global network
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For our Delegates:
- Your questions answered – exclusive interviews, panel discussions and Q&A with our speakers
- Skip the business suit – live chat with presenters from your home or office
- Meet the experts – video and 121 messaging with a global community
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For our Supplier Partners:
- Extend your brand with a dedicated team to build your personalised virtual booth
- Know your audience – analytics and reporting on your visitors
- Press Play – HD Live streaming of your presentation broadcast globally
- Build Connections with 121 video messaging and live chat
Advisory Board
RAJ PENDSE
Architect Silicon Packaging At Facebook FRL (Facebook Reality Labs), Facebook
BALACHANDRAN RAJENDRAN
Chief Technology Officer, EDA, DELL EMC
DR. JOHN PELLERIN
Vice President, R&D Operations, GlobalFoundries
GAURANG N. CHOKSI
Vice President, Technology Development, Director, Assembly And Test Technology Development Core Competencies, Intel Corporation
DR. THOMAS MANFRED MÜLLER
Executive Vice President Research & Development, Volkswagen Group China
CYRUS MEWAWALLA
Head Of Thematic Research, Globaldata
Agenda
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8:00 - 8:30
8:00-8:30 Event Registration and Networking
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8:30 - 9:00
OPENING SPEECH: Covid-19 implications for manufactures and suppliers and industry’s response to the pandemic
• Long term implications for semiconductor and electronics sectors • Evaluating the economic impact • Strategies to ensure continuity in supply chain and way to move forward • Identifying the challenges and recognising opportunities brought by the pandemic
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9:00 - 9:30
PRESENTATION: Intelligence and electrification of the automobile
• Increasing levels of ADAS depend on progress in image sensors, and LiDAR and radar systems: • Review the challenges of automotive imaging conditions for the sensor optimisation • Review the growing need for AI assistance to make local decisions At the same time, the drive train is going fully electric: • Review the progress in efficient conversion between battery and motor • Review role of Wide Bandgap materials for higher efficiency, smaller size and weight, and better cooling. • Review functional safety for the automotive design process to deliver the car of the future
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10:00 - 10:30
Managing supply chain disruption: Challenges and opportunities in semiconductor and electronics manufacturing supply chain management
• Supply Chain 4.0: can IoT, Big Data Analytics, Cloud Computing, Robotics, Additive Manufacturing, Blockchain, Augmented Reality and Artificial Intelligence help mitigate supply chain risk? • Digital supply networks that enable end-to end visibility, collaboration, responsiveness, agility, and optimisation must be built and designed to anticipate disruptions and mitigate impacts
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10:30 - 11:00
PRESENTATION: How to Use Streaming Analytics to Create a Real-Time Digital Twin
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11:00 - 11:30
Advanced Bonding Technologies for Next Generation 3D and SIP Devices
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11:30 - 11:45
Networking break
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11:45 - 12:!5
Industry 4.0- How AI is transforming manufacturing
• Using IoT to leverage the power of smart machines and real-time analytics to maximise data • Exploring how smart sensors and actuators will enhance manufacturing and industrial processes • Machine to machine communication for better practice
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12:15 - 12:55
PANEL DISCUSSION: Big data analytics development in semiconductor manufacturing
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12:55 - 13:35
PANEL: Internet of Things in consumer connected devices
• Successful deployment of IoT systems • Bringing IoT devices into the self-driving vehicles • Innovative techniques for IoT infrastructure security • Interoperability of IoT communication technologies • Overcoming challenges around sensor and integrated circuits developments • Preparing the industry for the new age of information
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13:35 - 14:00
Lunch break and networking
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14:00 - 14:30
Sensors and MEMs- Beyond human senses
• The growth in LIDAR Sensors, Visual cue sensors, Pressure sensors, Proximity sensors and Bio-sensors
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14:30 - 15:10
PANEL DISCUSSION: Advancement in 5G infrastructure and services
• Beyond first deployment • Analysing how 5G will impact disruptive technologies • Wireless communication - opportunities and challenges • 5G and national security implications - How will 5G improve intelligence, surveillance, and reconnaissance systems and processing • How will 5G introduce new methods of command and control
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15:10 - 15:30
CASE STUDY: Flexible displays for wearable technology- Unlocking innovative product designs
• How will flexible displays and sensors ensure wearables are thin, light and robust • How will they facilitate greater user experience and compatibility with the user’s lifestyle
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15:30 - 15:45
Networking break
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15:45 - 16:15
PRESENTATION: Advanced Packaging - Heterogeneous Integration
A Heterogeneous Integration Roadmap is critically needed to focus on new materials and new devices, new architecture, designs, manufacturing processes and new methodologies to bring diverse components together into a System-in-Package (SiP). • Addressing future vision • Exploring heterogeneous Integration for special applications
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16:15 - 17:00
PANEL: Technological development for the future of the automotive sector and connected mobility
• Winners and losers in the autonomous driving race • How to enhance Car2Car or Car2X Communication • Intelligent solutions for driving in cities - Road safety and city infrastructure assessment • Connected vehicles (IoT, 5G, Smart cities) • Exploring the growing demand of in-vehicle semiconductors • Creating a future of mobility that is safe and sustainable
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17:00 - 17:40
PANEL: The evolution of the semiconductor and consumer electronics markets and restructuring of the global supply chain post pandemic
• Assessing the future of the semiconductor and consumer electronic industries post Covid-19 • Is China facing a post-pandemic manufacturing exodus? In the era of trade wars and coronavirus, not made in China becomes the global tech's next big trend • New manufacturing clusters in Southeast Asia - companies and governments are investing to relocate production back home or diversify it into Southeast Asia
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17:40 - 18:10
Final keynote address
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18:10 - 19:00
Networking and end of the conference
Speaker page
Speakers
Sponsors
Headline Partner
Partners
Sponsors
Press Releases
Media Center
Our portfolio includes customised virtual events, including thought provoking and educational webinars that allow you to connect with the world's largest semiconductor manufacturers and technology firms. If you are interested in finding out more, please visit our Semiconductor & Electronics channel
Watch our previous webinars:
Enabling a connected society: Designing 5G chips
The future of Mobility: Autonomous vehicles - Moving forward to Level 4
Press Releases:
Coming Soon
Sponsorship Enquiries
To enquire about sponsorship opportunities for the Global Semiconductor and Electronics Forum, please contact:
Pratheeva Kotalawela
E-mail: Pratheeva.Kotalawela@ns-mediagroup.com
Speaking Opportunities
To enquire about speaking opportunities for the Global Semiconductor and Electronics Forum, please contact:
Nadia Rozario
E-mail: Nadia.Rozario@ns-mediagroup.com
Marketing Enquiries
If you would like to join the Global Semiconductor and Electronics Forum as a Media Partner, please contact:
Tanya Casey
E-mail: Tanya.Casey@ns-mediagroup.com