About this event
Global Semiconductor and Electronics Forum (GSEF) brings together the end-to-end value chain in semiconductors, automotive, telecommunication, consumer electronics and design supply chain. As one of the industry’s most important gatherings, the forum explores current and future trends and finds solutions to business-hindering challenges.
GSEF 2022
Semiconductors will enable the low latency, high bandwidth, pixel-heavy world soon to be spawned by the widespread deployment of 5G, but it will require a series of industry resets involving new architectures, business models, and materials-engineering breakthroughs. The industry is reshaping itself to enable the age of artificial intelligence (AI) and the Internet of Things (IoT)
Moore’s Law has been given a new lease of life by new chip architectures, including those based on 3D multi-Storey integrated circuits and tightly co-packaged multi-functional chip sets. As more processing is pushed to the edge, the data from automobiles, smart phones, robots, and drones will increasingly be processed in-device. This new distributed model will help reduce network congestion and future cyber threats.
Why Attend?
NETWORK
This is an exceptional networking opportunity for industry accelerators. Meet senior executives to make valuable connections through one-to-one meetings and networking service offered by our platform.
We invite the following job titles:
CEO
CTO
Chief Strategy Officer
Chief Innovation Officer
COO
Chief Marketing/Product Officer
Head of Mobility
Head of Customer Experience
Head of Digital Strategy
Head of Brand Strategy
Head of Technology
Head of R&D
Head of Engineering
Head of Manufacturing
Head of Product Line
Head of Design
LEARN
Be seen as a thought-leader and showcase your solutions to a captive audience; collaborate and problem-solve with like-minded peers and enjoy in-depth sessions and case-studies from the best minds in the industry.
Key topics will include:
Autonomous Driving
Semiconductor Technology
5G/6G technology
Advanced Manufacturing Processes
Connected cars
Industry 4.0
Advanced Test Solutions
Electronics Supply Chain
Advanced Packaging Technologies
AI & VR
Big Data & Robotics
MEMS and sensors
Cloud Computing
Cyber Security
Machine Learning
Experience
The conference discusses the vital connections between process, tools and techniques to manage change. Update your knowledge to create new strategies enabling you to enact change.
Develop new business relationships through our pre-arranged one-to-one meetings.
Targeted 1:1 Business Meetings – How does it work?
All delegates will be offered the exclusive opportunity to engage in pre-arranged, private business meetings with selected organisations of their choice.Registrants will be individually matched according to their business needs and immediate and future priorities.
Agenda
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09:00 - 09:40
OUTLOOK PANEL: NAVIGATING THROUGH CHANGE: STATE OF THE INDUSTRY IN 2022
Speakers: Brian Markwalter
Thomas Sonderman
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09:40 - 10:00
FIRESIDE CHAT: HOW IS THE CHIP ACT GOING TO TRANSFORM THE INDUSTRY IN THE US
Speakers: Marla Dowell
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10:00 - 10:40
PANEL: BUILDING RESILIENT SUPPLY CHAINS
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10:40 - 11:20
PRESENTATION: NXP semiconductors
Speakers: Lars Reger
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11:20 - 11:45
The role of 5G in accelerating digital transformation
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11:45 - 12:10
NEXT-GENERATION AI - WHAT’S ON THE HORIZON?
Speakers: Alan Lee
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13:35 - 14:00
PRESENTATION: NEXT-GENERATION MEMORY AND STORAGE; 3D NAND INNOVATIONS AND DISRUPTION
Speakers: Yan Li, VP of Design Engineering at Western Digital
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14:00 - 14:25
QUANTUM COMPUTING AND THE NEXT BIG THING IN ADVANCED COMPUTING
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THE INTELLIGENT, CONNECTED, AUTONOMOUS CAR: IN THE FAST LANE TO THE FUTURE
Speakers: Eric Gierahn
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THE EVOLUTION OF IoT
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5G, 6G AND THE NEXT LEVEL OF ADVANCED COMMUNICATIONS
Speakers: Neil McRae
Volker Ziegler
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FIRESIDE CHAT: BREAKTHROUGHS FOR EMERGING SECURITY CHALLENGES
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WHAT’S NEXT FOR INDUSTRY 4.0 AND THE SMART FACTORY
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Ultra-Pure Materials for Next Generation Semiconductor Applications
Speakers: Kaumba Sakavuyi
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NEXT-GENERATION SENSORS
Speakers: Yan Li, VP of Design Engineering at Western Digital
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ADVANCES IN PACKAGING: BACK-END MANUFACTURING AS THE NEW COMPETITIVE EDG
Speakers: Ruurd Boomsma
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ELECTRIFICATION AND WORKING TOWARDS NET ZERO
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Presentation from Advantest
Speakers: Michael Chang
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NEW DEVELOPMENTS GAN EPIWAFER TECHNOLOGY ADDRESSING 5G INFRASTRUCTURE, HANDSET POWER SWITCHING SECTORS
Advisory Board
Thy Tran, Vice President of DRAM Process Integration at Micron Technology
Micron Technology, Inc
Jennifer Zhao
Executive Vice President and General Manager, Advanced Optical Sensors Division - ams
Speakers 2022
Michael Chang
Vice President and General Manager, Advantest Cloud Solutions (ACS)
Yan Li, VP of Design Engineering at Western Digital
VP of Design Engineering at Western Digital
Marla Dowell
Director, NIST Communications Technology Laborator and NIST Boulder Laboratory
Eric Gierahn
Senior Engineering Group Manager, General Motors
Alan Lee
Corporate Vice President and Head of Research and Advanced Development, AMD
Brian Markwalter
SVP Research & Standards, Consumer Technology Association
Kaumba Sakavuyi
R&D Director, Heraeus Epurio
Thomas Sonderman
President & CEO, SkyWater Technology
Neil McRae
Group Chief Architect, MD Architecture and Technology Strategy, BT
Volker Ziegler
6G Leadership, Nokia Bell Labs
Ruurd Boomsma
CTO, Besi
Lars Reger
Executive Vice President and CTO, NXP Semiconductors
Speakers 2021
Mohammed Dogar
Senior Director Global Business Development, Renesas
Charles Ferland
VP & GM Edge Computing & Telecom, Lenovo
Kathrin Kind-Trueller
Manager AD Cybersecurity Processes and Tools, Volkswagen
Mark Papermaster
Chief Technology Officer and Executive Vice President, AMD
Tuğser Sariünal
Head of Production Engineering Innovation, Toyota Motor Europe
Manny Singh
Principal Marketing Manager, Renesas
Erik Varney
Managing Director of Solutions Architecture for IIoT and Automotive, Verizon Business
Laith Altimime
President, SEMI Europe
Emma Grant
VP Strategy Development, Verizon
Bernd Meurer
Regional CTO, BT
Islam Salama
VP, Intel
Raj Narasimhan
Corporate Vice President of Global Quality, Micron Technology
Antonietta Mastroianni
Chief Digital & IT Officer, Proximus
Eric Hardouin
Vice President, Ambient Connectivity Research Domain, Orange Labs
Mike Lavigne
Director, Head of Experience Strategy & Design, Nissan Motors
Herve Charles
Director Systems & Automation, NXP Semiconductors
Paul van Ulsen
CEO, Sallend Engineering
Balachandran Rajendran
Chief Technology Officer, EDA / Semiconductor, Dell EMC
James Misener
Senior Director, Product Management, Qualcomm
Joe Barry
Vice President of Wireless Communications Business Unit, Analog Devices
Christian Ohde
Global Product Director for Semiconductor, Lead Frame and Connectors, Atotech Group
Zhu Limin
Lead of Electrics/Electronics Development, SAIC Volkswagen
Maxime Flament
Chief Technology Officer, 5G Automotive Association (5GAA)
Ronan McLaughlin
Senior Corporate Strategy Manager, Verizon
Mike Orme
Thematic Research Consultant, GlobalData
Lil Read
Thematic Analyst, GlobalData
Matthew Gooding
News Editor, Tech Monitor
David Bicknell
Principal Analyst, Thematic Research, GlobalData
Sponsors
GSEF 2022 Sponsors
Past Partners
Press Releases
Media Centre
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5GAA bridges the automotive and telecommunication industries in order to address society’s connected mobility and road safety needs with applications such as automated driving, ubiquitous access to services, integration into intelligent transportation and traffic management. |
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EV News from Emobility Technology International keeps you up to date with new innovations in electric vehicle technology, electromobility and other EV news. E-motec.net is a true catalyst for debate and exchange, bringing new insights into the technologies progressing a new era of clean transport. |
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Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices. Semiconductor Digest consists of a website, a magazine, a daily newsletter and six topical newsletters. www.semiconductordigest.com |
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SEMI is the industry association representing the global electronics manufacturing and design supply chain: semiconductors, manufacturing, design, mobility, MedTech, MEMS, sensors, materials, printed and flexible, micro- & nano electronics. With offices and staff in Brussels, Berlin, and Grenoble, SEMI Europe serves and represents the interests of our global members across Europe. |
Sponsorship Enquiries
To enquire about sponsorship opportunities for the Global Semiconductor and Electronics Forum, please contact:
Pratheeva Kotalawela
E-mail: Pratheeva.Kotalawela@progressivemediainternational.com
Speaking Opportunities
To enquire about speaking opportunities for the Global Semiconductor and Electronics Forum, please contact:
Marta Pacheco
E-mail: Marta.Pacheco@progressivemediainternational.com
Marketing Enquiries
If you would like to join the Global Semiconductor and Electronics Forum as a Media Partner, please contact:
Bilyana Hadzhikyanova
E-mail: Bilyana.Hadzhikyanova@ns-mediagroup.com