Recent world developments have put a spotlight on the role smart connected devices will play in society and our everyday lives. As a result, developers seek to understand how devices’ abilities to sense, think, act and connect will help them anticipate and automate − to simplify life and remove barriers. In this talk we will share how these abilities are becoming a central feature across all connected devices and are driving convergence and commonality in approach.

Speakers:

Lars Reger

• Advancement in 5G infrastructure and services
• Building a Secure 5G Architecture
• Analysing how 5G will impact disruptive technologies and digital experience
• Wireless communication - opportunities and challenges
• 5G and national security implications - How will 5G improve intelligence, surveillance, and reconnaissance systems and processing
• The real potential of 5G and beyond - 5G evolution (5GE) continuing the trend towards increased bandwidth, increased coverage, and increased volumes of data
• Perspective on 6G technology, architecture and vision for 2030

Speakers:

Eric Hardouin

Gint Atkinson

Graham Wheeler

Volker Ziegler

• The impact of the pandemic on the automotive product planning in the near future? Does it impact medium term plans?
• Electronics and connectivity: the next 5 years in the sensor and in-vehicle electronics innovation
• ADAS/AV and 5G connectivity: What more is needed in the next 5 years to see 5G fully integrated in the ADAS/AV? Is 5G fit for automotive purpose?
• The world of IoT: What are the hottest services that your customers are asking for? How do you see cars integrating into smart cities?

Speakers:

Dr. Sebastian Mair

Hans Adlkofer

Hans Stork

James Misener

Maxime Flament

Sebastian Wong

• Higher frequencies, component density, weight & size reduction and thermal balance requirements increase the need for EMI shielding solutions in semiconductor industry
• New materials and processes for mass manufacturing of EMI Shielding under evaluation in semicon supply chain
• Inkjet printing of particle-free Ag-ink as a digital and additive process for EMI Shielding
• Direct selective printing enables full design flexibility
• Integration of hi-volume all-in manufacturing equipment and ink consumable by one supplier reduces supply chain interfaces and development time

Speakers:

Franz Vollmann

• Increased data generation, data storage and data analysis requires ever more advanced device technologies
• For a long time device scaling has been the main solution to performance improvement but this is no longer sufficient
• Advanced packaging technologies open up new possibilities for performance improvement and enabling new architectures
• To fully utilise the potential of advanced node devices with advanced packaging structures the requirements for the back end technology start to move in direction of front end
• Some examples of advanced connection technologies will be presented as well as an outlook will be given

Speakers:

Ruurd Boomsma

• Increasing levels of ADAS depend on progress in image sensors, and LiDAR and radar systems:
• Review the challenges of automotive imaging conditions for the sensor optimisation
• Review the growing need for AI assistance to make local decisions At the same time, the drive train is going fully electric:
• Review the progress in efficient conversion between battery and motor
• Review role of Wide Bandgap materials for higher efficiency, smaller size and weight, and better cooling.
• Review functional safety for the automotive design process to deliver the car of the future

Speakers:

Hans Stork

Discussing the amount of machine learning that is coming for consumer electronics devices and how we desperately need more efficient computation and memory architectures to enable more use cases without severe impacts to battery life

Speakers:

Michael Pate

A Heterogeneous Integration Roadmap is critically needed to focus on new materials and new devices, new architecture, designs, manufacturing processes and new methodologies to bring diverse components together into a System-in-Package (SiP).
• Addressing future vision
• Exploring heterogeneous Integration for special applications

Speakers:

Ramin Farjadrad

• How data analytics – and managing it - in semiconductor manufacturing has changed
• The challenges managing big data brings
• The lack of uniformity across different manufacturers • Software testing
• Big data in the supply chain
• The impact of COVID – how it is accelerating change

Speakers:

Balachandran Rajendran

David Bicknell

Gunaseelan Ponnuvel

Raghu Nambiar