Dr. Islam A. Salama is a Vice President with Intel Corporation in the Manufacturing, Supply Chain and Operations organization. His work focuses on high-density interconnect packaging in the areas of capacity expansion, capital equipment, outsource manufacturing and business operations across Intel products from technology development to high-volume manufacturing.
Dr. Salama began his career at Intel in 2003. He has held engineering and business leadership roles in multiple areas, including Business Operations, Outsource Manufacturing, Technology Pathfinding, Substrate Core competency and Packaging Technology Development. Most recently, his leadership has been instrumental in advancing heterogeneously integrated devices - an effort considered essential to the success of the company’s and industry’s data-centric transformation.
Dr. Salama is a board member and elected fellow of the Laser Institute of America, as well as a frequent keynote and plenary speaker at international industry conferences and symposiums. He holds more than 100 patents in a range of areas, including laser materials processing, device fabrication, high-density interconnect technologies, microelectronics packaging and materials engineering. He published more than 30 technical articles, book chapters, and industry proceedings in the same fields.
Dr. Salama holds a bachelor’s degree in metallurgical engineering, a master’s degree in materials engineering from Drexel University in Philadelphia, and a doctorate in materials engineering and laser processing from the College of Optics and Photonics at the University of Central Florida.